Wafer Bonding System Market By Type ( Direct Bonding, Anodic Bonding, Solder/Eutectic/ Diffusion Bonding, Glass-Frit Bonding & Adhesive Bonding), By Application ( Semiconductor, Solar Energy, Opto-electronic & MEMS), Estimation & Forecast, 2017-2025

January 2018

 Pages: 175

 ERC 7019

The Global Wafer Bonding System Market is projected to grow with a CAGR of 10.15% during the forecast period of 2017 to 2022.

Wafer bonding system is a packaging technology that is used on the wafer-level. It is used for the packaging of microelectromechanical systems (MEMS), microelectronics, optoelectronics, and nanoelectromechanical systems (NEMS). A wafer bonder binds two wafers together, typically by means of temporary bonding using a bonding agent or by permanent bonding of the oxide film surfaces using a self-bonding technique. The wafer bonding system includes direct bonding or fusion bonding, anodic bonding, eutectic bonding and adhesive bonding. Direct bonding is mainly used for the manufacturing of Silicon on Insulator (SOI) wafers, sensors and actuators. Anodic bonding is used to seal glass to silicon wafers in electronics and microfluidics.

Market Determinants

The persistent demand for wafer bonding systems is majorly driven by the augmented production ramp in advanced MEMS devices, CMOS image sensors, and advanced packaging. In addition to this, increasing use of direct bonding for the manufacturing of Silicon on Insulator (SOI) wafers, sensors and actuators is pushes the market growth. However, limited bonding and its strength, coupled with restrictions on post processing after the bonding process are some major restraints which might hamper the market growth.

MARKET DETERMINANTS IMPACT ANALYSIS 2012 Vs 2022

wafer bonding market


Segment Analysis

The global wafer bonding system market is segmented on the basis of type, application and geography. By type, the market is segmented as direct bonding, anodic bonding, solder/eutectic/ diffusion bonding, glass-frit bonding, adhesive bonding and others. On the basis of application, the market is bifurcated as semiconductor, solar energy, opto-electronic, MEMS and others. Geographically, the market is segmented into North America, Europe, China, India, South- East Asia and Japan.
Some major market players of the wafer bonding system market are Tokyo Electron, EV Group, SüSS MICROTEC SE, NxQ, AYUMI INDUSTRY, Palomar Technologies, Dynatex International, Applied Microengineering and 3M.

GLOBAL WAFER BONDING SYSTEM MARKET REVENUE VS. GROWTH, 2017-2022

wafer bonding system market revenue


GLOBAL WAFER BONDING SYSTEM MARKET SEGMENTATION

By Type

   • Direct Bonding
   • Anodic Bonding
   • Solder/Eutectic/ Diffusion Bonding
   • Glass-Frit Bonding
   • Adhesive Bonding
   • Others

By Application

   • Semiconductor
   • Solar Energy
   • Opto-electronic
   • MEMS
   • Others

By Geography

   • North America
   • China
   • Europe
   • Japan
   • India
   • South East Asia

KEY MARKET PLAYERS

   • Tokyo Electron
   • EV Group
   • SüSS Microtec SE
   • NxQ
   • Ayumi Industry
   • Palomar Technologies
   • Dynatex International
   • Applied Microengineering
   • 3M

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    What Information does this report contain?

    • What was the market size of the Wafer Bonding System Market in 2017 and the expected market size by 2025, along with the growth rate?
    • An in-depth analysis of the current impacting factors, opportunities and challenges/restraints in the market
    • Which are the largest revenue generating products, services or regions and their comparative growth rate?
    • Which technology is in trend and how would it evolve during the forecast period (2017 - 2025)?
    • Which are the leading companies in the Wafer Bonding System Market and their competitive positioning basis their market share, product portfolio, strategic attempts and business focus?

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