Low Pressure Molding with Polyamide Market is projected to grow with a CAGR of 5.8% during the forecast period of 2017 to 2025.
In 2016, the amber and others segment generated the highest revenue share of the global hair extension market. Low pressure molding with polyamides is a technique used to encapsulate and protect electronics. This molding process is environmentally compatible, as most of the materials used during this process are derived from natural ingredients and the leftover scraps & substances are biodegradable or renewable in nature. Polyamide materials are high performance hot-melt adhesives that are 100% reusable. Initially, the polyamide material is heated until it gains a liquid form. It is then injected into a mold set at a very low pressure. Once injected into the cold mold set, the hot liquid flows and fills up the cavity around the electronic to be encapsulated. The hot polyamide is injected continuously in order to compensate the shrinkage loss observed upon the cooling of the polyamide. Low pressure molding with polyamides helps to obtain better protection and sealing of electronic products. Moreover, the polyamide material can reach each and every corner of the component to be encapsulated, thus making it ideal for molding sensitive components.
Table of Content